LS-BGA60F-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

10.50mm [0.413"]
2.05mm [0.081"]
1.00mm
[0.039"]
10.00mm
[0.394"]
0.8mm typ.
8.00mm
[0.315"]
Top View
6.40mm [0.252"]
1
4.5mm [0.178"]
2.69mm [0.106"]
Side View
2
Ø 0.20mm [Ø 0.008"]
Substrate: 1.59mm ±0.18mm [0.062" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
Non-clad.
Description: Surface mount Foot
60 position BGA land socket.
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without
notice.
LS-BGA60F-61 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: LS-BGA60F-61 Dwg
Scale: 4:1
Rev: C
Date: 2/8/06
Modified: 07/01/14