LS-BGA576D-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.631mm (x4) [0.064"]
5.02mm (x4)
[0.198"]
30.04mm [1.183"]
25mm sq. (BGA pkg outline)
23mm [0.906"]
1mm typ.
1.89mm (x4) [0.074"]
30.04mm
[1.183"]
20mm (x4)
[0.787"]
1.5mm (x4)
[0.059"]
1mm typ.
23mm
[0.906"]
Side View
1.27mm (x4)
[0.050"]
Ø 0.51mm (x576) pad [Ø 0.020"]
Ø 1.27mm (x8) [Ø 0.050"]
3.76mm
[0.148"]
1.67mm
[0.066"]
0.2mm dia. [0.008"]
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Description: Giga-snaP BGA SMT Land Socket
576 position 1.0 mm pitch BGA smt lands to terminal pins.
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. non
clad
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
RoHS
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA576D-41 Drawing
Status: Released
Scale: 6:1
Rev: A
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: E Smolentseva
File: LS-BGA576D-41 Dwg.mcd
Date: 2/10/10
Modified: