LS-BGA561A-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.1mm [0.043"]
23mm [0.906"]
1.1mm [0.043"]
23mm [0.906"]
0.8mm typ.
0.55mm
Side View
4.55mm [0.179"]
2.96mm [0.116"]
0.55mm
1
2
0.2mm dia. [0.008"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. non clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
RoHS
Description: Giga-snaP BGA SMT Land Socket
561 position BGA surface mount pattern to terminal pins (0.8mm centers, 27x27 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA561A-61 Drawing
Status: Released
Scale: 5:1
Rev: B
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: E Smolentseva
File: LS-BGA561A-61 Dwg.mcd
Date: 2/16/10
Modified: 01/18/13, DH