LS-BGA54C-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Tooling hole (X2)
BGA54C
Y
See BGA pattern code to the
right for actual pattern layout
3.75mm
[0.148"]
Top View
X
(reference only)
3.52mm _1.93mm
[0.139"] _[0.076"]
1
Side View
(reference only)
0.20mm [0.008"] dia.
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 ^{FR4/G10 or equivalent high temp material. 17µm}
[1/2 oz.] Cu clad. SnPb plating.
Pins: material- Brass Alloy 360 1/2 hard; finish-
2 _{0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).}
6.00mm
[0.236"]
Top View of Land Pattern
Scale: 2:1
0.75mm typ.
Ø 0.41mm [Ø 0.016"]
BGA pad
Pin Count
54
Array Size
6x9
Pitch
0.75mm
Adapter Perimeter (XxY) 5.25mm [0.207"] x 7.50mm [0.295"]
Description: Land Socket.
54 position 0.75mm pitch BGA SMT land pattern to male pins.
LS-BGA54C-61 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: LS-BGA54C-61 Dwg
Scale: N/A
Rev: A
Date: 11/4/05
Modified:
Tolerances: diameters ±0.03mm [±0.001”], PCB
perimeters ±0.13mm [±0.005”], PCB thicknesses
±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm
[±0.005”] unless stated otherwise. Materials and
specifications are subject to change without
notice.