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LS-BGA520A-31 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice
Top View
0.95mm
[0.037"]
0.95mm
[0.037"]
40.00mm
[1.575"]
1.27mm typ.
Side View
0.00mm
[0.000"]
40.00mm
[1.575"]
1
1.68mm
[0.066"]
0.20mm [0.008"]±0.0005"
3.76mm
[0.148"]
38.10mm
[1.500"]
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 FR4/G10 or equivalent high temp material.
Description: Giga-snaP BGA SMT Land Socket
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
520 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 31x31 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA520A-31 Drawing
Status: Released
Scale: 3:1
Rev: A
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Drawing: S. Faiz
File: LS-BGA520A-31 Dwg
Date: 2/26/09
Modified: