LS-BGA360A-31 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

TOP VIEW
Ø 0.51mm pad (x360)
1.27mm
22.86mm 25.00mm
1.07mm
1.07mm
22.86mm
25.00mm
SIDE VIEW
3.76mm
1.68mm
1
0.20mm
22.86mm
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
Description: Giga-snaP BGA SMT Land Socket
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
360 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 19x19 array).
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA360A-31 Drawing
Status: Released
Scale: 4:1
Rev: A
© 2013 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: S. Faiz
File: LS-BGA360A-31 Dwg
Date: 11/13/13
Modified: