LS-BGA304A-31 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

31.00mm [1.220"]
1.53mm [0.060"]
1.53mm
[0.060"]
Top View
31.00mm
[1.220"]
1.27mm
[0.050"] typ.
1
3.76mm
Side View _[0.148"]
2
1.68mm
[0.066"]
Ø 0.20mm [Ø 0.008"] typ.
R o H S C O M P L IA N T
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
304 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 23x23 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA304A-31 Drawing
Status: Released
Scale: 2:1
Rev: A
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: H. Hansen
File: LS-BGA304A-31 Dwg
Date: 8/24/06
Modified: