LS-BGA256E-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.00mm
[0.039"]
17.00mm
[0.669"]
17.00mm
[0.669"]
1.00mm
[0.039"]
1.00mm
[0.039"]
A
th
b
F
w
A
a
Side View
3.76mm
[0.148"]
0.20mm
[0.008"]±0.0005"
15.00mm
[0.591"]
1
1.68mm
[0.066"]
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
256 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 16X16 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LSL-BSG-BA2G5A6E2-5461ED-r4a1wDinrgawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S Natarajan
File: LS-BGA256E-41 Dwg
Scale: 4:1
Rev: B
Date: 3/2/05
Modified: 4/18/05