LS-BGA136C-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
10mm
[0.394"]
0.6mm
[0.024"]
8.8mm
[0.346"]
0.6mm
[0.024"]
14mm
[0.551"]
0.8mm typ.
Side View
12.8mm
[0.504"]
4.55mm
[0.179"]
2.96mm
[0.116"]
0.2mm dia.
[0.008"]
1
2
RoHS
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
Description: Giga-snaP BGA SMT Land Socket
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
136 position BGA surface mount land pattern to terminal pins (0.8mm centers, 17x8 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA136C-61 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: C
Drawing: J. Glab
Date: 2/15/07
File: LS-BGA136C-61 Dwg.mcd
Modified: 01/18/13, Dh