LS-BGA1225C-31 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
0.91mm
[0.036"]
0.91mm
[0.036"]
45.00mm
[1.772"]
45.00mm
[1.772"]
1.27mm typ.
Side View
1
3.76mm
[0.148"]
Ø 0.20mm [0.008"] ±0.0005"
43.18mm
[1.700"]
2
1.68mm
[0.066"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
Description: Giga-snaP BGA SMT Land Socket
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
1225 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 35x35 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA1225C-31 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S.Natarajan
File: LS-BGA1225C-31 Dwg
Scale: 3:1
Rev: A
Date: 6/3/05
Modified: