LS-BGA1156A-05 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
2.36mm
[0.093"]
2.50mm
[0.098"]
42.73mm [1.682"]
2.50mm [0.098"]
2.74mm [0.108"]
33.00mm [1.299"]
42.73mm 33.00mm
[1.682"]
[1.299"]
Ø 0.85mm (x2) [Ø 0.033"]
2.54mm
[0.100"]
18.86mm (x4)
[0.743"]
5.08mm
[0.200"]
18.86mm [0.743"]
1.00mm
[0.039"] typ.
0-80 Threaded Insert
Ø 0.48mm (x778) [Ø 0.019"]
5.59mm
[0.220"]
Side View
1
2.41mm
[0.095"]
2
1.00mm [0.039"] typ.
Ø 0.20mm [Ø 0.008"] typ.
Substrate: 3.18mm ±0.125mm [0.125" ±0.005"]
1 FR4/G10 or equivalent high temp material.
Non-clad.
2
Pin: Brass - PS-2
Plating: 10u" Au over 50u" Ni min.
RoHS
Description: Giga-snaP BGA SMT land socket
1156 position surface mount land pattern to terminal pins (1.0mm centers, 34x34 array). To be used with GHz
sockets.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA1156A-05 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr Suite 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: LS-BGA1156A-05 Dwg
Scale: 2:1
Rev: B
Date: 1/30/08
Modified: 11/12/09 MT/MR