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LS-BGA1152A-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice
1.00mm
[0.039"]
1.00mm
[0.039"]
35.00mm
[1.378"]
35.00mm
[1.378"]
Top View
A
t
b
F
1.00mm typ.
w
A
a
1
Side View
3.76mm
[0.148"]
Ø 0.20mm [0.008"] ±0.0005"
2
33.00mm [1.299"]
1.68mm [0.066"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 FR4/G10 or equivalent high temp material.
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
1152 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 34x34 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA1152A-41 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: LS-BGA1152A-41 Dwg
Scale: 2:1
Rev: B
Date: 9/9/04
Modified: 4/18/05