LS-BGA100J-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.50mm
[0.059"]
15.00mm
[0.591"]
1.50mm
[0.059"]
15.00mm
[0.591"]
Side View
3.76mm
[0.148"]
Ø 0.20mm [0.008"] ±0.0005"
12.00mm
[0.472"]
1.00mm typ.
1.68mm
1 ^[0.066"]
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
100 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 13x13 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA100J-41 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File:LS-BGA100J-41Dwg
Scale: 4:1
Rev: A
Date: 10/26/06
Modified: