GT-BGA-2030 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

A
32.225
GT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATION
Features
• Directly mounts to target PCB (needs tooling holes) with hardware.
• Wide temperture range (-55C to +160C).
• High current capability (up to 5 A).
• Excellent signal integrity a high frequencies.
• Low and stable contact resistance for reliable production yield.
A
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead time.
TOP VIEW
9.8618
7.94
32.60
Recommended torque = 135.6 N-cm
/ 12 in-lbs
1.59
6.35
GT elastomer
SECTION A-A
Description: GT-BGA400 Socket 1.27mm pitch 27mm 20x20 array IC
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
GT-BGA-2030 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 44.05
STATUS: Released
ENG: S. Huang
FILE: GT-BGA-2030 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 12/16/2015
REV. A
SCALE: 2:1