GT-BGA-2025 Datasheet, PDF (1/7 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations

GT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +160C).
• High current capability (up to 5A).
• Over 70GHz bandwidth @ -1dB for edge pins
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
Torque until hard stop is reached
100°
37.250
34.500
38.100
7.588
5.113
48.325
4.550
5.113
Description: GT BGA484 19mm IC 22x22 array 0.8mm Pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
GT-BGA-2025 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 133.04
STATUS: Released
ENG: J. Vavra
FILE: GT-BGA-2025 Dwg
SHEET: 1 OF 7
DRAWN BY: M. Raske
DATE: 12/02/2015
56.956
REV. A
SCALE: 1:1