GT-BGA-2019 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

A1 Corner
49.225 socket lid
GT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
42.600
IC frame
IC
Ball guide
GT elastomer
Target board
Features
• Wide temperature range (-55C to +160C).
• High current capability (up to 5A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead time.
DETAIL A
SCALE 8 : 1
TOP VIEW
Recommended torque = 23-27 in -lbs
50
56.481
55.95
A1 Corner
7.500
4.500
A
7.500
1.787
FRONT QUARTER SECTION VIEW
30.225
32.725
SIDE VIEW
3.156 ^7.256
9.500
23
43
Description: Clamshell GT-BGA572 24x24 array 25x25 mm 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
GT-BGA-2019 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 159.85
STATUS: Released
ENG: S. Huang
FILE: GT-BGA-2019 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 3/20/2015
IC frame
REV. A
SCALE: 1:1