CBT-BGA-7507 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

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21.00
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C )
28.2
High current capability (up to 2.9A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
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Compatible BGA
Floating guide
0.4 Full Compression
Middle Guide
13.6
4.1
15.0
2.6
Bottom guide
5.8
Target PCB
0.1 Pre-Compression
Description: CBT-BGA175 14x13 0.4 Snap Lid
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7507 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 12.25
STATUS: Released
ENG: B. Schatz
FILE: CBT-BGA-7507 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 09/18/2015
REV. A
SCALE: 3:1