CBT-BGA-7501 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

20.225
CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
• Wide temperature range (-55C to +180C)
• High current capability (up to 2.9A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
0.41
28.225
0.12
DETAIL A
SCALE 16 : 1
20
A
14.5
4.10
5.52
3
1.50
12.225
8
12.225
8
Description: CBT-BGA36 2.4x2.4mm 0.4mm pitch 6x6 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7501 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 17.05
STATUS: Released
ENG: V. Panavala
FILE: CBT-BGA-7501 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 04/04/2014
REV. B
SCALE: 2:1