CBT-BGA-7017 Datasheet, PDF (1/8 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

25.48
38
32.23
CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
• Wide temperature range (-55C to +180C)
• High current capability (up to 2.2A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
42
A1 Corner
probe board not supplied with the socket
7.23 5.83
42.33
0.1375
6.42
0.1375
18.725
1.60
2.76
Description: CBT-BGA 12mm 0.4mm pitch 29x29 array POP socket
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance
±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change
without notice.
CBT-BGA-7017 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight: 46.96
Quarter Section View
STATUS: Released
ENG: E. Smolentseva
FILE: CBT-BGA-7017 Dwg
SHEET: 1 OF 8
DRAWN BY: M. Raske
DATE: 10/09/2014
REV. B
SCALE: 3:2