CBT-BGA-6054 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
35
FEATURES:
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
Recommended torque is 13 N-cm (1.2 lbf-in)
12.5000
60.4705
32.7785
3.525
7.6670
2.362
4.2500
6.2500
Description: CBT-BGA 13mm 0.8mm pitch 15x15 array BGA225
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm
[±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6054 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 68.50
19.73
STATUS: Released
ENG: E. Smolentseva
FILE: CBT-BGA-6054 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 10/13/2015
REV. A
SCALE: 1.3:1