CBT-BGA-6019 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
TRUE 9.00
FEATURES:
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
49.23
40.00
33.60
48.71
55.82
75.24
8.11
9.25
6.71
30.73
A
9.25
DETAIL A
SCALE 10 : 1
7.11
4.86
30.73
Description: CBT-BGA521 23 x 23 x 0.8mm 27 x 27 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6019 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 126.11
STATUS: Released
ENG: E. Smolentseva
FILE: CBT-BGA-6019 Dwg
61.18
SHEET: 1 OF 5
DRAWN BY: E. Smolentseva
DATE: 1/20/12
REV. C
SCALE: 1:1