CBT-BGA-6015 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 8A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity
variations.
• Automated probe manufacturing enables low cost and short
lead time.
97.465
49.210
68.100
60.166
74.725
100.712
9.896
7.210
60.225
Description: CBT-BGA-6015, 52.5mm IC, 51x51 array, 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6015 Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: -
Finish: -
Weight: 386.76
STATUS: Released
DRAWN BY: M. Raske
FILE: CBT-BGA-6015 Dwg
SHEET: 1 OF 4
SCALE: 1:1
DATE: 9/11/2012
REV. A