CBT-BGA-6013 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C)
High current capability (up to 4A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
DETAIL M ^{Automated probe manufacturing enables low cost and short lead time}
SCALE 10 : 1
49.23
Recommended Torque: 7 in lbs
Or Hand tighten Compression screw ~1/3 turn
after it touches the BGA top surface.
33.60
19.63
6.03
46.63
M
4.63
57.08
11.50
26.23
11.50
3.9
18.50
28.73
Description: CBT-BGA523 21mm 0.8mm 25x25 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance
±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6013 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 131.02
STATUS: Released
ENG: V. Panavala
FILE: CBT-BGA-6013
76.42
32.50
SHEET: 1 OF 5
DRAWN BY: V. Panavala
DATE: 9/6/2012
2.20
6.35
REV. C
SCALE: 1:1