IRPT2059A Datasheet, PDF (6/12 Pages) International Rectifier – Power Module for 2 hp Motor Drives

IRPT2059A
Mounting Procedure
Mounting
1. Connect the driver board and the IRPT2059A power
module.
2. Remove all particles and grit from the heat sink and power
substrate.
3. Spread a .004" to .005" layer of silicone grease on the heat
sink, covering the entire area that the power substrate will
occupy. Recommended heat sink flatners is .001 inch/inch and
Total Indicator Readout (TIR) of .003 inch below substrate.
4. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
5. Place the 2 M4 mounting screws through the PCB and
power module and into the heat sink and tighten the screws to
1 Nm torque.
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Figure 7. Power Module Mounting Screw Sequence
Power Connections
The power module pin designation, function and other details
can be obtained from the package outline in Figure 8 and circuit
diagram in Figure 9. Three phase input connections made to pins
R, S and T and inverter output connections are made to pins U, V
and W. Positive rectifier output and positive inverter bus are
brought out to pins RP and P respectively in order to provide DC
bus capacitor soft charging implementation option. The current
shunt terminals are connected to pins IS1, IS2 and IS3, IS4 on
the positive and negative DC rails respectively.
Functional Information
Heat Sink Requirements
Figures 4a-4b show the thermal resistance of the heat sink
required for various output power levels and Pulse-Width-
Modulated (PWM) switching frequencies. Maximum total losses
of the unit are also shown. This data is based on the following
key operating conditions:
• The maximum continuous combined losses of the rectifier
and inverter occur at full pulse-width-modulation. These
maximum losses set the maximum continuous operating
temperature of the heat sink.
• The maximum combined losses of the rectifier and inverter
at full pulse-width-modulation under overload set the
incremental temperature rise of the heat sink during
overload.
• The minimum output frequency at which full load current
is to be delivered sets the peak IGBT junction temperature.
• At low output frequency, IGBT junction temperature tends
to follow the instantaneous fluctuations of the output
current. Thus, peak junction temperature rise increases as
output frequency decreases.
Over Temperature Protection
Over temperature can be detected using the NTC thermistor
included in the power module for thermal sensing. Protection
circuit that initiates a shutdown if the temperature of the IMS
substrate exceeds a set level can be implemented. The nominal
resistance vs. temperature characteristic of the thermistor is
given in Figure 6.
Voltage Rise During Braking
The motor will feed energy back to the DC link during
regenerative braking, forcing the DC bus voltage to rise above
the level defined by the input line voltage. Deceleration of the
motor must be controlled by appropriate PWM control to keep
the DC bus voltage within the rated maximum value.
page 6