IRPT1053A Datasheet, PDF (6/12 Pages) International Rectifier – Power Module for 1 hp Motor Drives

IRPT1053A
Mounting Procedure
Functional Information
Mounting
1. Connect the driver board and the IRPT1053A power
module.
2. Remove all particles and grit from the heat sink and
power substrate.
3. Spread a .004" to .005" layer of silicone grease on the
heat sink, covering the entire area that the power substrate
will occupy. Recommended heat sink flatners is .001 inch/
inch and Total Indicator Readout (TIR) of .003 inch below
substrate
4. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
5. Place the 2 M4 mounting screws through the PCB and
power module and into the heat sink and tighten the screws
to 1 Nm torque.
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Figure 6. Power Module Mounting Screw Sequence
Power Connections
The power module pin designation, function and other
details can be obtained from the package outline in Figure 8
and circuit diagram in Figure 9. Three phase input connec-
tions made to pins R, S and T and inverter output connections are
made to pins U, V and W. Positive rectifier output and positive
inverter bus are brought out to pins RP and P respectively in or-
der to provide DC bus capacitor soft charging implementation
option. The current shunt terminals are connected to pins ISI, IS2
and IS3, IS4 on the positive and negative DC rail respectively.
Heat Sink Requirements
Figures 4a-4b show the thermal resistance of the heat
sink required for various output power levels and Pulse-
Width-Modulated (PWM) switching frequencies. Maximum
total losses of the unit are also shown. This data is based
on the following key operating conditions:
• The maximum continuous combined losses of the recti-
fier and inverter occur at full pulse-width-modulation.
These maximum losses set the maximum continuous
operating temperature of the heat sink.
• The maximum combined losses of the rectifier and in-
verter at full pulse-width-modulation under overload set
the incremental temperature rise of the heat sink during
overload.
• The minimum output frequency at which full load cur-
rent is to be delivered sets the peak IGBT junction
temperature.
• At low output frequency, IGBT junction temperature
tends to follow the instantaneous fluctuations of the
output current. Thus, peak junction temperature rise
increases as output frequency decreases.
Over Temperature Protection
Over temperature can be detected using the NTC ther-
mistor included in the power module for thermal sensing.
Protection circuit that initiates a shutdown if the tempera-
ture of the IMS substrate exceeds a set level can be
implemented. The nominal resistance vs. temperature
characteristic of the thermistor is given in Figure 6.
Voltage Rise During Braking
The motor will feed energy back to the DC link during
regenerative braking, forcing the DC bus voltage to rise
above the level defined by input line voltage. Deceleration
of the motor must be controlled by appropriate PWM con-
trol to keep the DC bus voltage within the rated maximum
value.
page 6
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