IRF8308MPBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Dual Sided Cooling Compatible

IRF8308MPbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
Parameter
R_θJA
R_θJA
R_θJA
R_θJC
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
R_θJ-PCB
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.022
Max.
45
–––
–––
1.4
–––
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
τJ
τJ
τ1
τ1
R1
R1
Ci= τi/Ri
Ci i/Ri
R2
R2
τ2 _τ2
R3 R4 _{Ri (°C/W)} τι (sec)
R3
R4
τa ^{0.99292 0.000074}
τ3 _τ3
τ4
τ4
2.171681 0.007859
24.14602 0.959
17.69469 32.6
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
ˆ Used double sided cooling, mounting pad with large heatsink.
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
‰ Mounted to a PCB with
small clip heatsink (still air)
‰ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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February 24, 2014