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IRF8306MPBF Datasheet, PDF (3/9 Pages) International Rectifier – HEXFET Power MOSFET plus Schottky Diode | |||
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Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
IRF8306MTRPbF
Max.
2.1
1.3
75
270
-40 to + 150
Units
W
°C
Typ.
âââ
12.5
20
âââ
1.0
0.017
Max.
60
âââ
âââ
1.66
âââ
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
ÏJ
ÏJ
Ï1
Ï1
R1
R1
Ci= Ïi/Ri
Ci i/Ri
R2
R2
Ï2
Ï2
R3
R4
Ri (°C/W) Ïι (sec)
R3
R4
ÏC 24.84696 2.379018
Ï3 Ï3
Ï4 Ï 10.92897 0.219018
Ï4 3.658783 0.00733
20.42272 15.9657
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling , mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
(still air).
www.irf.com
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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