|
IRF8302MPBF Datasheet, PDF (3/9 Pages) International Rectifier – HEXFET Power MOSFET plus Schottky Diode | |||
|
◁ |
IRF8302MPbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.8
1.8
104
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.022
Max.
45
âââ
âââ
1.2
âââ
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
R 1R 1
R 2R 2
R 3R 3
R 4R 4
Ri (°C/W) Ïi (sec)
ÏJ ÏJ
Ï1 Ï1
ÏAÏA 14.507
12.335077
Ï2 Ï2
Ï3 Ï3
Ï4 Ï4
8.742 0.1865935
18.806 1.9583548
Ci= Ïi/Ri
Ci= Ïi/Ri
2.945 0.0065404
SINGLE PULSE
( THERMAL RESPONSE )
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
(At lower pulse widths ZthJA & ZTHJC are combined)
 Used double sided cooling , mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
 Rθ is measured at TJ of approximately 90°C.
back and with small clip heatsink.
 Surface mounted on 1 in. square Cu
(still air).
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback
February 17, 2014
|
▷ |