IRF7769L1PBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Optimized for Synchronous Rectification

IRF7769L1TRPbF
Absolute Maximum Ratings
P_D @T_C = 25°C
P_D @T_C = 100°C
P_D @T_A = 25°C
T_P
T_J
T_STG
f Power Dissipation
f Power Dissipation
c Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJ-Can
R_θJ-PCB
e Junction-to-Ambient
j Junction-to-Ambient
k Junction-to-Ambient
fl Junction-to-Can
Parameter
Junction-to-PCB Mounted
10
Max.
125
63
3.3
270
-55 to + 175
Units
W
°C
Typ.
–––
12.5
20
–––
–––
Max.
45
–––
–––
1.2
0.4
Units
°C/W
1
0.1
0.01
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.001
0.0001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
τ_{J τJ}
τ_{1 τ1}
R_1R1
Ci= τi/Ri
Ci i/Ri
R_2R2
τ_{2 τ2}
R_3R3
R_4R4
τ_Cτ
Ri (°C/W)
0.1080
0.6140
τi (sec)
0.000171
0.053914
τ_{3 τ3}
τ_{4 τ4}
0.4520
0.006099
1.47e-05 0.036168
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case „
Notes:
ƒ Surface mounted on 1 in. square Cu board, steady state.
‰ Mounted on minimum footprint full size board with metalized
„ T_C measured with thermocouple incontact with top (Drain) of part. ^{back and with small clip heatsink.}
ˆ Used double sided cooling, mounting pad with large heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
board (still air).
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
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February 18, 2013