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IRF7749L2TRPBF Datasheet, PDF (3/11 Pages) International Rectifier – DirectFETPower MOSFET | |||
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IRF7749L2TR/TR1PbF
Absolute Maximum Ratings
PD @TC = 25°C
PD @TC = 100°C
PD @TA = 25°C
f Power Dissipation
f Power Dissipation
c Power Dissipation
Parameter
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJ-Can
RθJ-PCB
e Junction-to-Ambient
j Junction-to-Ambient
k Junction-to-Ambient
fl Junction-to-Can
Parameter
Junction-to-PCB Mounted
10
Max.
125
63
3.3
270
-55 to + 175
Typ.
âââ
12.5
20
âââ
âââ
Max.
45
âââ
âââ
1.2
0.5
Units
W
°C
Units
°C/W
1
D = 0.50
0.20
0.1
0.10
0.05
0.02
0.01
0.01
0.001
0.0001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
ÏJ ÏJ
Ï1 Ï1
R1R1
Ci= Ïi/Ri
Ci i/Ri
R2R2
Ï2 Ï2
R3R3
Ï3 Ï3
R4R4
ÏCÏ
Ri (°C/W)
0.10804
0.61403
Ï4 Ï4
0.45202
Ïi (sec)
0.000171
0.053914
0.006099
0.00001 0.036168
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case Â
Notes:
 Surface mounted on 1 in. square Cu board, steady state.
 Mounted on minimum footprint full size board with metalized
 TC measured with thermocouple incontact with top (Drain) of part. back and with small clip heatsink.
 Used double sided cooling, mounting pad with large heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
3
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