IRF6716MPBF_09 Datasheet, PDF (3/9 Pages) International Rectifier – DirectFETPower MOSFET

IRF6716MPbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
™ Power Dissipation
™ Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
™g Junction-to-Ambient
dg Junction-to-Ambient
eg Junction-to-Ambient
fg Junction-to-Case
Junction-to-PCB Mounted
™Ã Linear Derating Factor
Max.
3.6
2.3
78
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.031
Max.
35
–––
–––
1.6
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
τ_{J τJ}
τ_{1 τ1}
R_1R1
Ci= τi/Ri
Ci= τi/Ri
R_2R2
τ_{2 τ2}
R_3R3
Ri (°C/W)
τ_{AτA 2.003}
τ_{3 τ3}
17.536
15.465
τi (sec)
0.000686
0.78614
28
0.01
0.001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1E-005 0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
10
100
1000
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
 Surface mounted on 1 in. square Cu board, steady state.
‚ Used double sided cooling , mounting pad.
ƒ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
„ T_C measured with thermocouple incontact with top (Drain) of part.
… R_θ is measured at T_J of approximately 90°C.
 Surface mounted on 1 in. square Cu (still ^{‚ Mounted to a PCB with}
air).
small clip heatsink (still air)
www.irf.com
ƒ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3