IRF6691PBF Datasheet, PDF (3/10 Pages) International Rectifier – DirectFET

Power MOSFET

PROVISIONAL
Absolute Maximum Ratings
P_D @ T_A = 25°C
P_D @ T_A = 70°C
P_D @ T_C = 25°C
e P ower D issipation
e P ower D issipation
f P ower D issipation
T_P
Peak Soldering Tem perature
T_J
O perating Junction and
T_STG
Storage Temperature Range
Thermal Resistance
R _θJA
R _θJA
R _θJA
R _θJC
P a ra m e te r
e m Junction-to-A m bient
k m Junction-to-A m bient
l m Junction-to-A m bient
f m Junction-to-C ase
R _θJ-PCB
Junction-to-PCB Mounted
e Linear D erating F actor
IRF6691PbF
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.022
Max.
45
–––
–––
1.4
–––
W
°C
U n its
°C/W
W /°C
100
10
1
0.1
0.01
0.001
D = 0.50
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
τ_{J τJ}
τ_{1 τ1}
R_1R1
Ci= τi/Ri
Ci= τi/Ri
R_2R2
τ_{2 τ2}
R_3R3
τ_{3 τ3}
0.0001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
R_{4R4 Ri (°C/W) τi (sec)}
τ_{AτA 0.678}
0.000860
τ_{4 τ4}
17.30 0.577560
17.57 8.940000
9.470 106.0000
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1
10
100
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
‰ Used double sided cooling , mounting pad.
Š Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
‹ R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
www.irf.com
‰ Mounted to a PCB with
small clip heatsink (still air)
Š Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3