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IRF6638PBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Ideal for CPU Core DC-DC Converters | |||
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IRF6638PbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
em Junction-to-Ambient
km Junction-to-Ambient
lm Junction-to-Ambient
fm Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
âââ
12.5
20
âââ
1.0
0.022
Max.
45
âââ
âââ
1.4
âââ
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
SINGLE PULSE
0.01
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
ÏJ ÏJ
Ï1 Ï1
R 1R 1
Ci= Ïi/Ri
Ci= Ïi/Ri
R 2R 2
Ï2 Ï2
0.01
0.1
R 3R 3
R 4R 4
Ri (°C/W) Ïi (sec)
Ï3 Ï3
Ï4 Ï4
ÏAÏA
1.280114
8.725568
21.75
0.000322
0.164798
2.2576
13.25114
69
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Â
Notes:
 Used double sided cooling , mounting pad.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
(still air).
www.irf.com
 Mounted to a PCB with
small clip heatsink (still air)
 Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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