IRF6622PBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – Ideal for CPU Core DC-DC Converters

Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
em Junction-to-Ambient
km Junction-to-Ambient
lm Junction-to-Ambient
fm Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
IRF6622PbF
Max.
2.2
1.4
34
270
-40 to + 150
Units
W
°C
Typ.
–––
12.5
20
–––
1.0
0.017
Max.
58
–––
–––
3.7
–––
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
Ri (°C/W) τi (sec)
R_1R1
R_2R2
R_3R3
R_4R4
R_5R5
1.620 0.000126
τ_{J τJ}
τ_{1 τ1}
τ_{AτA 2.141 0.001354}
τ_{2 τ2}
τ_{3 τ3}
τ_{4 τ4}
τ_{5 τ5}
22.289 0.375850
Ci= τi/Ri
Ci= τi/Ri
0.1
SINGLE PULSE
( THERMAL RESPONSE )
20.046 7.41
11.914 99
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
1E-006 1E-005 0.0001
0.001
0.01
0.1
1
10
100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
‰ Used double sided cooling , mounting pad.
Š Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
‹ R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
(still air).
www.irf.com
‰ Mounted to a PCB with
small clip heatsink (still air)
Š Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3