AN-1136 Datasheet, PDF (24/26 Pages) International Rectifier – Application Note

Appendix A.15 5x6 Dual devices
Device outline
Figure A.15.1 shows the outline for these devices. The
relative pad positions are controlled to an accuracy of
±0.050mm. For full dimensions and tolerances of each
device, and to find out its size and outline, refer to the
relevant product data sheet and package outline
drawing.
0.03
0.12
0.44
0.12
1.71
0.83
4.18
0.25
2.40
0.55
0.44
(dimensions in mm)
Figure A.15.1 5x6 Dual device outline
Substrate/PCB layout
Evaluations have shown that the best overall
performance is achieved using the substrate/PCB
layout shown in Figure A.15.2 (a and b).
1.75
0.85
0.42
0.06
0.67
4.05
0.90
0.42
(dimensions in mm)
Figure A.15.2(a) 5x6 Dual substrate/PCB layout
2.48
4.08
1.27
(dimensions in mm)
Figure A.15.2(b) 5x6 Dual substrate/PCB layout
Stencil design
Evaluations have shown that the best overall
performance is achieved using the stencil design
shown in Figure A.15.3 (a and b).
Note: This design is for a stencil thickness of 0.127mm
(0.005"). The reduction should be adjusted for stencils
of other thicknesses.
0.34
0.62
1.33
1.45
0.80
0.40
(dimensions in mm)
Figure A.15.3(a) 5x6 Dual stencil design
1.27
1.25
1.61
2.78
2.48
Discrete PQFN Technology
www.irf.com
1.27
(dimensions in mm)
Figure A.15.3(b) 5x6 Dual stencil design
AN-1136
Version 16 (revision history), May 2015
Board Mounting Application Note
Page 24 of 25