IR3476 Datasheet, PDF (20/21 Pages) International Rectifier – 12A Highly Integrated SupIRBuck IR3476 TM

12A Highly Integrated SupIRBuck^TM
IR3476
STENCIL DESIGN
 The Stencil apertures for the lead lands should be
approximately 80% of the area of the lead lads.
Reducing the amount of solder deposited will
minimize the occurrences of lead shorts. If too
much solder is deposited on the center pad the
part will float and the lead lands will open.
 The maximum length and width of the land pad
stencil aperture should be equal to the solder
resist opening minus an annular 0.2mm pull back
in order to decrease the risk of shorting the
center land to the lead lands when the part is
pushed into the solder paste.
Figure 33: Stencil Design
* Contact International Rectifier to receive an electronic PCB Library file in your preferred format
20 August 8, 2012 | ADVANCED DATASHEET | V2.1 | PD97603