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IRFR3910TRLPBF Datasheet, PDF (2/11 Pages) International Rectifier – Ultra Low On-Resistance
IRFR/U3910
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
∆V(BR)DSS/∆TJ
RDS(on)
VGS(th)
gfs
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
100 ––– ––– V VGS = 0V, ID = 250µA
––– 0.12 ––– V/°C Reference to 25°C, ID = 1mA
––– ––– 0.115
VGS = 10V, ID = 10A „
2.0 ––– 4.0 V VDS = VGS, ID = 250µA
6.4 ––– ––– S VDS = 50V, ID = 9.0A†
––– ––– 25
––– ––– 250
µA VDS = 100V, VGS = 0V
VDS = 80V, VGS = 0V, TJ = 150°C
––– ––– 100 nA VGS = 20V
––– ––– -100
VGS = -20V
––– ––– 44
ID = 9.0A
––– ––– 6.2 nC VDS = 80V
––– ––– 21
VGS = 10V, See Fig. 6 and 13 „†
––– 6.4 –––
VDD = 50V
––– 27 ––– ns ID = 9.0A
––– 37 –––
RG = 12Ω
––– 25 –––
RD = 5.5Ω, See Fig. 10 „†
Between lead,
D
––– 4.5 ––– nH 6mm (0.25in.)
––– 7.5 –––
from package
G
and center of die contact…
S
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
––– 640 –––
––– 160 –––
––– 88 –––
VGS = 0V
pF VDS = 25V
ƒ = 1.0MHz, See Fig. 5†
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) †
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
––– ––– 16
A showing the
integral reverse
G
––– ––– 60
p-n junction diode.
S
––– ––– 1.3 V TJ = 25°C, IS = 9.0A, VGS = 0V „
––– 130 190 ns TJ = 25°C, IF = 9.0A
––– 650 970 nC di/dt = 100A/µs „†
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by „ Pulse width ≤ 300µs; duty cycle ≤ 2%
max. junction temperature. ( See fig. 11 )
‚ VDD = 25V, starting TJ = 25°C, L = 3.1mH
RG = 25Ω, IAS = 9.0A. (See Figure 12)
… This is applied for I-PAK, Ls of D-PAK is measured between lead and
center of die contact
ƒ ISD ≤ 9.0A, di/dt ≤ 520A/µs, VDD ≤ V(BR)DSS, † Uses IRF530N data and test conditions
TJ ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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