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IRFR3607PBF_15 Datasheet, PDF (2/10 Pages) International Rectifier – High Efficiency Synchronous Rectification in SMPS | |||
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IRFR/U3607PbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
âV(BR)DSS/âTJ
RDS(on)
VGS(th)
IDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Drain-to-Source Leakage Current
75 âââ âââ
âââ 0.096 âââ
âââ 7.34 9.0
2.0 âââ 4.0
âââ âââ 20
V VGS = 0V, ID = 250µA
d V/°C Reference to 25°C, ID = 5mA
g m⦠VGS = 10V, ID = 46A
V VDS = VGS, ID = 100µA
µA VDS = 75V, VGS = 0V
IGSS
Gate-to-Source Forward Leakage
âââ âââ 250
âââ âââ 100
VDS = 60V, VGS = 0V, TJ = 125°C
nA VGS = 20V
Gate-to-Source Reverse Leakage
âââ âââ -100
VGS = -20V
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
gfs
Qg
Qgs
Qgd
Qsync
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Total Gate Charge Sync. (Qg - Qgd)
115 âââ âââ
âââ 56 84
âââ 13 âââ
âââ 16 âââ
âââ 40 âââ
S VDS = 50V, ID = 46A
nC ID = 46A
g VDS = 38V
VGS = 10V
ID = 46A, VDS =0V, VGS = 10V
RG(int)
Internal Gate Resistance
âââ 0.55 âââ
td(on)
Turn-On Delay Time
âââ 16 âââ
tr
Rise Time
âââ 110 âââ
td(off)
Turn-Off Delay Time
âââ 43 âââ
tf
Fall Time
âââ 96 âââ
Ciss
Input Capacitance
âââ 3070 âââ
Coss
Output Capacitance
âââ 280 âââ
Crss
Reverse Transfer Capacitance
âââ 130 âââ
j Coss eff. (ER) Effective Output Capacitance (Energy Related) âââ 380 âââ
h Coss eff. (TR) Effective Output Capacitance (Time Related)
âââ 610 âââ
â¦
ns VDD = 49V
ID = 46A
g RG = 6.8â¦
VGS = 10V
pF VGS = 0V
VDS = 50V
Æ = 1.0MHz
j VGS = 0V, VDS = 0V to 60V
h VGS = 0V, VDS = 0V to 60V
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
Ãd (Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
 âââ âââ 80
A MOSFET symbol
D
showing the
âââ âââ 310
integral reverse
G
p-n junction diode.
S
âââ âââ 1.3
g V TJ = 25°C, IS = 46A, VGS = 0V
âââ 33 50 ns TJ = 25°C
VR = 64V,
âââ 39 59
TJ = 125°C
âââ 32 48 nC TJ = 25°C
g IF = 46A
di/dt = 100A/µs
âââ 47 71
TJ = 125°C
âââ 1.9 âââ A TJ = 25°C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Calculated continuous current based on maximum allowable junction  ISD ⤠46A, di/dt ⤠1920A/µs, VDD ⤠V(BR)DSS, TJ ⤠175°C.
temperature. Bond wire current limit is 56A. Note that current
Â
Pulse width ⤠400µs; duty cycle ⤠2%.
limitations arising from heating of the device leads may occur with  Coss eff. (TR) is a fixed capacitance that gives the same charging time
some lead mounting arrangements.
as Coss while VDS is rising from 0 to 80% VDSS.
 Repetitive rating; pulse width limited by max. junction
 Coss eff. (ER) is a fixed capacitance that gives the same energy as
temperature.
Coss while VDS is rising from 0 to 80% VDSS.
 Limited by TJmax, starting TJ = 25°C, L = 0.12mH
RG = 25â¦, IAS = 46A, VGS =10V. Part not recommended for use
above this value.
 When mounted on 1" square PCB (FR-4 or G-10 Material). For recom-
mended footprint and soldering techniques refer to application note #AN-994.
 Rθ is measured at TJ approximately 90°C.
2
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