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IRFR3303TRLPBF Datasheet, PDF (2/11 Pages) International Rectifier – Ultra Low On-Resistance | |||
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IRFR/U3303PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
âV(BR)DSS/âTJ
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
30   V VGS = 0V, ID = 250µA
 0.032  V/°C Reference to 25°C, ID = 1mA
  0.031 ⦠VGS = 10V, ID = 18A Â
2.0  4.0 V VDS = VGS, ID = 250µA
9.3 ÂÂÂ ÂÂÂ S VDS = 25V, ID = 18A
ÂÂÂ ÂÂÂ 25
ÂÂÂ ÂÂÂ 250
µA VDS = 30V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 150°C
ÂÂÂ ÂÂÂ 100 nA VGS = 20V
ÂÂÂ ÂÂÂ -100
VGS = -20V
ÂÂÂ ÂÂÂ 29
ID = 18A
ÂÂÂ ÂÂÂ 7.3 nC VDS = 24V
ÂÂÂ ÂÂÂ 13
VGS = 10V, See Fig. 6 and 13 Â
ÂÂÂ 11 ÂÂÂ
VDD = 15V
ÂÂÂ
ÂÂÂ
99 ÂÂÂ
16 ÂÂÂ
ns
ID = 18A
RG = 13â¦
ÂÂÂ 28 ÂÂÂ
RD = 0.8â¦, See Fig. 10 Â
ÂÂÂ 4.5 ÂÂÂ
Between lead,
D
6mm (0.25in.)
nH from package
G
ÂÂÂ 7.5 ÂÂÂ
and center of die contactÂ
S
ÂÂÂ 750 ÂÂÂ
VGS = 0V
ÂÂÂ 400 ÂÂÂ pF VDS = 25V
ÂÂÂ 140 ÂÂÂ
 = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) Â
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
ÂÂÂ ÂÂÂ 33Â
A showing the
integral reverse
G
ÂÂÂ ÂÂÂ 120
p-n junction diode.
S
ÂÂÂ ÂÂÂ 1.3
ÂÂÂ 53 80
ÂÂÂ 94 140
V TJ = 25°C, IS = 18A, VGS = 0V Â
ns TJ = 25°C, IF = 18A
nC di/dt = 100A/µs Â
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
 Starting TJ = 25°C, L = 590µH
RG = 25â¦, IAS = 18A. (See Figure 12)
 ISD ⤠18A, di/dt ⤠140A/µs, VDD ⤠V(BR)DSS,
TJ ⤠150°C
 Pulse width ⤠300µs; duty cycle ⤠2%.
Â
Caculated continuous current based on maximum allowable junction
temperature; Package limitation current = 20A.
 This is applied for I-PAK, LS of D-PAK is measured between
lead and center of die contact
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
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