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IRFI530N Datasheet, PDF (2/8 Pages) International Rectifier – HEXFET Power MOSFET
IRFI530N
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage
100 ––– ––– V VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.12 ––– V/°C Reference to 25°C, ID = 1mA†
RDS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.11 Ω VGS = 10V, ID = 6.6A „
VGS(th)
Gate Threshold Voltage
2.0 ––– 4.0 V VDS = VGS, ID = 250µA
gfs
Forward Transconductance
6.4 ––– ––– S VDS = 50V, ID = 9.0A†
IDSS
Drain-to-Source Leakage Current
––– ––– 25 µA VDS = 100V, VGS = 0V
––– ––– 250
VDS = 80V, VGS = 0V, TJ = 150°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
––– ––– 100 nA VGS = 20V
––– ––– -100
VGS = -20V
Qg
Total Gate Charge
––– ––– 44
ID = 9.0A
Qgs
Gate-to-Source Charge
Qgd
Gate-to-Drain ("Miller") Charge
––– ––– 6.2
––– ––– 21
nC VDS = 80V
VGS = 10V, See Fig. 6 and 13 „†
td(on)
Turn-On Delay Time
––– 6.4 –––
VDD = 50V
tr
td(off)
Rise Time
Turn-Off Delay Time
–––
–––
27 –––
37 –––
ns
ID = 9.0A
RG = 12Ω
tf
Fall Time
––– 25 –––
RD = 5.5Ω, See Fig. 10 „†
LD
Internal Drain Inductance
LS
Internal Source Inductance
––– 4.5 –––
––– 7.5 –––
Between lead,
6mm (0.25in.)
nH
from package
and center of die contact
D
G
S
Ciss
Input Capacitance
––– 640 –––
VGS = 0V
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
––– 160 –––
––– 88 –––
pF VDS = 25V
ƒ = 1.0MHz, See Fig. 5†
C
Drain to Sink Capacitance
––– 12 –––
ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) †
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Min. Typ. Max. Units
Conditions
––– ––– 12
––– ––– 60
MOSFET symbol
A showing the
integral reverse
p-n junction diode.
D
G
S
––– ––– 1.3 V TJ = 25°C, IS = 6.6A, VGS = 0V „
––– 130 190 ns TJ = 25°C, IF = 9.0A
––– 650 970 nC di/dt = 100A/µs „†
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
‚ VDD = 15V, starting TJ = 25°C, L = 3.1mH
RG = 25Ω, IAS = 9.0A. (See Figure 12)
ƒ ISD ≤ 9.0A, di/dt ≤ 520A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
… t=60s, ƒ=60Hz
† Uses IRF530N data and test conditions