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IRFB4127PBF_15 Datasheet, PDF (2/8 Pages) International Rectifier – High Efficiency Synchronous Rectification in SMPS
IRFB4127PbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min.
V(BR)DSS
Drain-to-Source Breakdown Voltage
200
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient
–––
RDS(on)
Static Drain-to-Source On-Resistance
–––
VGS(th)
Gate Threshold Voltage
3.0
IDSS
Drain-to-Source Leakage Current
–––
–––
IGSS
Gate-to-Source Forward Leakage
–––
Gate-to-Source Reverse Leakage
–––
RG(int)
Internal Gate Resistance
–––
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min.
gfs
Forward Transconductance
79
Qg
Qgs
Qgd
Qsync
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Coss eff. (ER)
Coss eff. (TR)
Total Gate Charge
–––
Gate-to-Source Charge
–––
Gate-to-Drain ("Miller") Charge
–––
Total Gate Charge Sync. (Qg - Qgd)
–––
Turn-On Delay Time
–––
Rise Time
–––
Turn-Off Delay Time
–––
Fall Time
–––
Input Capacitance
–––
Output Capacitance
–––
Reverse Transfer Capacitance
–––
Effective Output Capacitance (Energy Related)h –––
Effective Output Capacitance (Time Related)g –––
Typ.
–––
0.23
17
–––
–––
–––
–––
–––
3.0
Typ.
–––
100
30
31
69
17
18
56
22
5380
410
86
360
590
Max. Units
Conditions
–––
–––
20
5.0
20
250
100
-100
V VGS = 0V, ID = 250μA
V/°C Reference to 25°C, ID = 5mAc
mΩ VGS = 10V, ID = 44A f
V VDS = VGS, ID = 250μA
μA VDS = 200V, VGS = 0V
VDS = 200V, VGS = 0V, TJ = 125°C
nA VGS = 20V
VGS = -20V
––– Ω
Max. Units
Conditions
––– S VDS = 50V, ID = 44A
150 nC ID = 44A
–––
VDS = 100V
–––
VGS = 10V f
–––
ID = 44A, VDS =0V, VGS = 10V
––– ns VDD = 130V
–––
ID = 44A
–––
RG = 2.7Ω
–––
VGS = 10V f
–––
VGS = 0V
–––
VDS = 50V
––– pF ƒ = 1.0MHz
–––
VGS = 0V, VDS = 0V to 160V h
–––
VGS = 0V, VDS = 0V to 160V g
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) c
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– 76 A MOSFET symbol
D
showing the
––– ––– 300
integral reverse
G
p-n junction diode.
S
––– ––– 1.3 V TJ = 25°C, IS = 44A, VGS = 0V f
––– 136 ––– ns TJ = 25°C
VR = 100V,
––– 139 –––
TJ = 125°C
––– 458 ––– nC TJ = 25°C
IF = 44A
di/dt = 100A/μs f
––– 688 –––
TJ = 125°C
––– 8.3 ––– A TJ = 25°C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by max. junction
temperature.
‚ Limited by TJmax, starting TJ = 25°C, L = 0.26mH
RG = 25Ω, IAS = 44A, VGS =10V. Part not recommended for use
above this value .
ƒ ISD ≤ 44A, di/dt ≤ 760A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
„ Pulse width ≤ 400μs; duty cycle ≤ 2%.
… Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
† Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
‡ When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application note #AN-994.
ˆ Rθ is measured at TJ approximately 90°C
2
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