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IRF9240 Datasheet, PDF (2/7 Pages) Seme LAB – P-CHANNEL POWER MOSFET | |||
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IRF9240
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
BVDSS
âBVDSS/âTJ
RDS(on)
VGS(th)
gfs
IDSS
Parameter
Drain-to-Source Breakdown Voltage
Temperature Coefficient of Breakdown
Voltage
Static Drain-to-Source On-State
Resistance
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
IGSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (âMillerâ) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min
-200
â
â
â
-2.0
4.0
â
â
â
â
28
3.0
4.5
â
â
â
â
â
â
â
â
Typ Max Units
ââ V
-0.20 â V/°C
â 0.5 â¦
â 0.58
â -4.0 V
â â S( )
â -25 µA
â -250
â -100
â 100 nA
â 60
â 15 nC
â 38
â 35
â 85
â 85 n s
â 65
6.1 â nH
1200
570 â pF
81 â
Test Conditions
VGS = 0V, ID = -1.0mA
Reference to 25°C, ID = -1.0mA
VGS = -10V, ID = -7.0Aâ
VGS = -10V, ID = -11A â
VDS = VGS, ID = -250µA
VDS > -15V, IDS = -7.0A â
VDS=-160V, VGS=0V
VDS =-160V
VGS = 0V, TJ = 125°C
VGS = -20V
VGS = 20V
VGS =-10V, ID = -11A
VDS =-100V
VDD = -100V, ID = -11A,
RG = 9.1â¦
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
VGS = 0V, VDS = -25V
f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS Continuous Source Current (Body Diode)
ISM Pulse Source Current (Body Diode) â
â â -11 A
â â -44
Test Conditions
VSD
trr
QRR
ton
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
â â -4.6 V
â 270 440 nS
â â 7.2 µC
Tj = 25°C, IS =-11A, VGS = 0V â
Tj = 25°C, IF = -11A, di/dt ⤠-100A/µs
VDD ⤠-50V â
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC
RthJA
Junction-to-Case
Junction-to-Ambient
For footnotes refer to the last page
2
Min Typ Max Units
â â 1.0
°C/W
â â 30
Test Conditions
soldered to a 2â square copper-clad board
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