IRDC3843W Datasheet, PDF (16/17 Pages) International Rectifier – USER GUIDE FOR IR3843W EVALUATION BOARD

IRDC3843W
Stencil Design
• The Stencil apertures for the lead lands should be approximately 80% of the area of the
lead lads. Reducing the amount of solder deposited will minimize the occurrences of lead
shorts. If too much solder is deposited on the center pad the part will float and the lead
lands will be open.
• The maximum length and width of the land pad stencil aperture should be equal to the
solder resist opening minus an annular 0.2mm pull back to decrease the incidence of
shorting the center land to the lead lands when the part is pushed into the solder paste.
10/27/2009