MOSFETIRF6602 Datasheet, PDF (1/9 Pages) International Rectifier – DirectFET™ Power MOSFET(Vdss=20V)

l Application Specific MOSFETs
l Ideal for CPU Core DC-DC Converters
l Low Conduction Losses
l Low Switching Losses
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount
Techniques
PD - 94363A
IRF6602
DirectFET^TM Power MOSFET
V_DSS
20V
R_DS(on) max
13mΩ@V_GS = 10V
19mΩ@V_GS = 4.5V
I_D
11A
8.8A
DirectFET™ ISOMETRIC
Description
The IRF6602 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET^TM packaging
to achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm
profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly
equipment and vapor phase, infra-red or convection soldering techniques. The DirectFET package allows dual sided cooling
to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6602 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power
the latest generation of processors operating at higher frequencies. The IRF6602 has been optimized for parameters that
are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
V_DS
I_D @ T_C = 25°C
I_D @ T_C = 70°C
I_DM
P_D @T_C = 25°C
P_D @T_C = 70°C
V_GS
T_J, T_STG
Parameter
Drain- Source Voltage
Continuous Drain Current, V_GS @ 4.5V
Continuous Drain Current, V_GS @ 4.5V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Thermal Resistance
Symbol
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
Junction-to-Ambientƒ
Junction-to-Ambient„
Junction-to-Ambient…
Junction-to-Case†
Junction-to-PCB mounted
Max.
20
11
8.8
88
2.3
1.5
18
± 20
-55 to + 150
Typ.
–––
12.5
20
3.0
1.0
Max.
55
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Units
V
A
W
mW/°C
V
°C
Units
°C/W
www.irf.com
1
04/24/02