IRVR101 Datasheet, PDF (1/15 Pages) International Rectifier – LIN Controlled Alternator Voltage Regulator

International
Rectifier
Preliminary Data Sheet
IRVR101
LIN Controlled Alternator Voltage Regulator
Features:
• 9600 Baud Rate
• 10.7 to 16.0V Setpoint Control
• Programmable Load Response
Control
• Programmable Field Excitation
• Full Diagnostic Capability
• Self Excitation
• Short Circuit Protected
• EMI and ESD Immunity
• Field Excitation, Temperature, and
Fault Status Feedback
• < 200uA Standby Current
Voltage Sense
LIN
Control
Fly back
Circuitry
Diode
Field
Driver
Phase Sense
B+
ROTOR
B+
RECTIFIER
F
STATOR
P
VOLTAGE REGULATOR
ALTERNATOR
Description
The IRVR101 is an integral alternator voltage regulator that allows for external control of the setpoint voltage in
an automotive charging system where optimized alternator output control is desired. The setpoint control is
achieved using the Local Interconnect Network (LIN) serial communications protocol. Slew rate control and
filtering of the interface lines provide electromagnetic compatibility. The regulator consists of a control ASIC,
discrete low side power MOSFET (field driver), re-circulation diode, and passive components. The discrete
circuitry allows for optimal flexibility with respect to the alternator rotor circuit and charging system
requirements. The IRVR101 is characterized over the temperature range of –40 ^oC to 150 ^oC.
Design
The IRVR101 is manufactured using thick-film hybrid technology.
The hybrid circuit can be customized for your application to
optimize performance and reliability. The hybrid circuit can also
be assembled in a custom housing with an insert–molded lead-
frame specifically designed for flame-soldering or heavy wire
bonding. Thick-film hybrid technology offers reliable high
temperature operation with excellent parametric stability over the
entire operating temperature range. Resistor values are trimmed
within +/-1% using laser equipment that provides precise
calibration of voltage and current sensing circuitry. The control IC
is attached to the substrate using flip chip technology in order to
optimize space and reliability. Bare die is also used for the low
side field driver and re-circulation diode in order to optimize
space and heat transfer.
Custom Thick-film Hybrid Module
www.irf.com
Preliminary Data Sheet
1