IRS2166DSPBF Datasheet, PDF (1/20 Pages) International Rectifier – PFC + BALLAST CONTROL IC

Data Sheet No. PD60292
IRS2166D(S)PbF
PFC + BALLAST CONTROL IC
Features
PFC, ballast control and 600 V half-bridge driver in one IC
Critical-conduction mode boost-type PFC
Programmable half-bridge over-current protection
Programmable preheat frequency
Programmable deadtime
Programmable preheat time
Programmable run frequency
RoHS compliant
End-of-life window comparator pin
Internal up/down current-sense fault counter
DC bus undervoltage reset
Lamp removal/auto-restart shutdown pin
Internal bootstrap MOSFET
Internal 15.6 V zener clamp diode on V_CC
Micropower startup (250 µA)
Latch immunity and ESD protection
Description
The IRS2166D is a fully integrated, fully protected 600 V
ballast control IC designed to drive all types of fluorescent
lamps. The IRS2166D is based on the popular IR2166
control IC with additional improvements to increase ballast
performance. PFC circuitry operates in critical conduction
mode and provides high PF, low THD, and DC bus
regulation. The IRS2166D features include programmable
preheat and run frequencies, programmable preheat time,
and programmable end-of-life protection. Comprehensive
protection features such as protection from failure of a lamp
to strike, filament failures, end-of-life protection, DC bus
undervoltage reset as well as an automatic restart function,
have been included in the design.
System Features
Improved V_BUS regulation voltage tolerance
Increased SD pin shutdown voltage threshold hysteresis
Changed EOL pin internal 2.0 V bias to a +/-10 µA OTA
Internal bootstrap MOSFET
Packages
16-Lead PDIP
IRS2166DPbF
16-Lead SOIC
IRS2166DSPbF
Application Diagram (Typical Only)
LPFC
DPFC
RBUS
F1
L
N
GND
RV1
L1
C1
BR1
CY
C2
CBUS
MPFC
RPFC
RVDC
CVDC
CPH
VBUS
1
CPH
2
RT
CT
RT
3
RPH
4
RPH
CT
5
CCOMP _COMP
6
RZX
ZX
7
PFC
8
HO
16
VS
15
VB
14
VCC
13
CVCC1
COM
12
LO
11
CS
10
SD/EOL
9
RH
O
CBOOT
CVCC2
RL
O
RLIM
DSD
DCOMP
IC BALLAST
CCS
CSD1
CSD2
RSUPPLY
MHS
LRES
DCP2
CSNUB
ML
S
RPU
RSD
DCP1
RCS
CDC
RDC
REOL1
REOL2
REOL3
CEOL
REOL4
CRES
Note: Thick traces represent high-frequency, high-current paths.
Lead lengths should be minimized and power and IC grounds should be separated to avoid high-frequency
noise problems.
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