IRLL024NQ Datasheet, PDF (1/10 Pages) International Rectifier – HEXFET® Power MOSFET

PD-94152
AUTOMOTIVE MOSFET
IRLL024NQ
Typical Applications
q Electronic Fuel Injection
HEXFET^® Power MOSFET
q Active Suspension
q Power Doors, Windows & Seats
q Cruise Control
q Air Bags
Benefits
q Advanced Process Technology
q Ultra Low On-Resistance
D
V_DSS = 55V
R_DS(on) = 0.065Ω
G
q 175°C Operating Temperature
q Repetitive Avalanche Allowed up to Tjmax
q Dynamic dv/dt Rating
I_D = 3.1A
S
q Automotive [Q101] Qualified
Description
Specifically designed for Automotive applications, this HEXFET^® Power MOSFET
in a SOT-223 package utilizes the lastest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of this Automotive
qualified HEXFET Power MOSFET are a 175°C junction operating temperature,
fast switching speed and improved repetitive avalanche rating. These benefits
combine to make this design an extremely efficient and reliable device for use in
Automotive applications and a wide variety of other applications.
The efficient SOT-223 package is designed for surface mount and the enlarged tab
provides improved thermal characteristics making it ideal in a variety of power
applications. Power dissipation of 1.0W is possible in a typical surface mount
application. Available in Tape & Reel.
SOT-223
Absolute Maximum Ratings
Parameter
Max.
I_D @ T_C = 25°C Continuous Drain Current, V_GS @ 4.5V
3.1
I_D @ T_C = 70°C Continuous Drain Current, V_GS @ 4.5V
2.6
I_DM
Pulsed Drain Current Q
12
P_D @T_C = 25°C Power DissipationS
1.3
Linear Derating Factor
8.3
V_GS
E_AS
I_AR
E_AR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche EnergyT
Avalanche CurrentQ
Repetitive Avalanche EnergyV
Peak Diode Recovery dv/dt U
±16
87
See Fig.16c, 16d, 19, 20
9.9
T_J, T_STG
Junction and Storage Temperature Range
Thermal Resistance
-55 to + 175
Parameter
Typ.
Max.
R_θJA
Junction-to-Amb. (PCB Mount, steady state)*
90
120
R_θJA
Junction-to-Amb. (PCB Mount, steady state)**
50
60
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
Units
A
W
mW/°C
V
mJ
A
mJ
V/ns
°C
Units
°C/W
1
03/16/01