IRHNA9064_15 Datasheet, PDF (1/8 Pages) International Rectifier – Simple Drive Requirements

PD - 91447C
RADIATION HARDENED
POWER MOSFET
SURFACE MOUNT (SMD-2)
IRHNA9064
JANSR2N7424U
60V, P-CHANNEL
REF: MIL-PRF-19500/655
RAD-Hard^™ HEXFET^® TECHNOLOGY
Product Summary
Part Number Radiation Level
IRHNA9064 100K Rads (Si)
IRHNA93064 300K Rads (Si)
RDS(on)
0.045Ω
0.045Ω
ID
-48A
-48A
QPL Part Number
JANSR2N7424U
JANSF2N7424U
International Rectifier’s RAD-Hard HEXFET^TM technol-
ogy provides high performance power MOSFETs for
space applications. This technology has over a de-
cade of proven performance and reliability in satellite
applications. These devices have been character-
ized for both Total Dose and Single Event Effects (SEE).
The combination of low Rds(on) and low gate charge
reduces the power losses in switching applications
such as DC to DC converters and motor control. These
devices retain all of the well established advantages
of MOSFETs such as voltage control, fast switching,
ease of paralleling and temperature stability of elec-
trical parameters.
SMD-2
Features:
n Single Event Effect (SEE) Hardened
n Low RDS(on)
n Low Total Gate Charge
n Proton Tolerant
n SimpleDriveRequirements
n Ease of Paralleling
n Hermetically Sealed
n Ceramic Package
n Light Weight
n Surface Mount
Absolute Maximum Ratings
Parameter
ID @ VGS = -12V, TC = 25°C Continuous Drain Current
ID @ VGS = -12V, TC = 100°C Continuous Drain Current
IDM
Pulsed Drain Current ➀
PD @ TC = 25°C
Max. Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➁
Avalanche Current ➀
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➂
TJ
TSTG
Operating Junction
Storage Temperature Range
Package Mounting Surface Temperature
Weight
Pre-Irradiation
Units
-48
-30
A
-192
300
W
2.4
W/°C
±20
V
500
mJ
-48
A
30
mJ
-4.4
V/ns
-55 to 150
o_C
300 (for 5 Sec.)
3.3 (typical)
g
For footnotes refer to the last page
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1
02/18/03