IRGS14C40LPBF_15 Datasheet, PDF (1/12 Pages) International Rectifier – MOST RUGGED IN INDUSTRY

PD - 95193A
IRGS14C40LPbF
Ignition IGBT ^{IRGSL14C40LPbF}
IRGB14C40LPbF
IGBT with on-chip Gate-Emitter and Gate-Collector clamps
Features
• Most Rugged in Industry
• Logic-Level Gate Drive
• > 6KV ESD Gate Protection
• Low Saturation Voltage
• High Self-clamped Inductive Switching Energy
TERMINAL DIAGRAM
Collector
Gate
R1
R2
•BV_{CES =} 370V min, 430V max
•I_C @ T_C = 110°C = 14A
•V_CE(on) typ= 1.2V @7A @25°C
• I_L(min)=11.5A @25°C,L=4.7mH
• Lead-Free
Description
The advanced IGBT process family includes a
MOS gated, N-channel logic level device which
is intended for coil-on-plug automotive ignition
applications and small-engine ignition circuits.
Unique features include on-chip active voltage
clamps between the Gate-Emitter and
Gate-Collector which provide over voltage
protection capability in ignition circuits.
Emitter
JEDEC TO-263AB _{JEDEC TO-262AA}
JEDEC TO-220AB
IRGS14C40L IRGSL14C40L IRGB14C40L
NOTE: IRGS14C40L is available in tape and reel. Add a suffix of
TRR or TRL to the part number to determine the orientation of the
device in the pocket, i.e, IRGS14C40LTRR or IRGS14C40LTRL.
Absolute Maximum Ratings
Parameter
V_CES
Collector-to-Emitter Voltage
I_C @ T_C = 25°C Continuous Collector Current
I_C @ T_C = 110°C Continuous Collector Current
I_G
Continuous Gate Current
I_Gp
Peak Gate Current
V_GE
Gate-to-Emitter Voltage
P_D @ T_C = 25°C Maximum Power Dissipation
P_D @ T = 110°C Maximum Power Dissipation
T_J
Operating Junction and
T_STG
Storage Temperature Range
V_ESD
Electrostatic Voltage
I_L
Self-clamped Inductive Switching Current
Max Unit
Condition
Clamped V RG = 1K ohm
20
A VGE = 5V
14
A VGE = 5V
1
mA
10
mA tPK = 1ms, f = 100Hz
Clamped V
125
W
54
W
- 40 to 175 °C
- 40 to 175 °C
6
KV C = 100pF, R = 1.5K ohm
11.5
A L = 4.7mH, T = 25°C
Thermal Resistance
Parameter
Min Typ
Max
Unit
Rθ_JC
Rθ_JA
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
1.2
40
°C/W
(PCB Mounted, Steady State)
Zθ_JC
Transient Thermal Impedance, Juction-to-Case (Fig.11)
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Page 1
11/19/04