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IRGP50B60PD1_06 Datasheet, PDF (1/11 Pages) International Rectifier – WARP2 SERIES IGBT WITH ULTRAFAST SOFT RECOVERY DIODE | |||
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SMPS IGBT
PD - 94625B
IRGP50B60PD1
WARP2 SERIES IGBT WITH
ULTRAFAST SOFT RECOVERY DIODE
Applications
⢠Telecom and Server SMPS
⢠PFC and ZVS SMPS Circuits
⢠Uninterruptable Power Supplies
⢠Consumer Electronics Power Supplies
Features
⢠NPT Technology, Positive Temperature Coefficient
⢠Lower VCE(SAT)
⢠Lower Parasitic Capacitances
⢠Minimal Tail Current
⢠HEXFRED Ultra Fast Soft-Recovery Co-Pack Diode
⢠Tighter Distribution of Parameters
⢠Higher Reliability
Benefits
⢠Parallel Operation for Higher Current Applications
⢠Lower Conduction Losses and Switching Losses
⢠Higher Switching Frequency up to 150kHz
C
G
E
n-channel
VCES = 600V
VCE(on) typ. = 2.00V
@ VGE = 15V IC = 33A
Equivalent MOSFET
ParametersÂ
RCE(on) typ. = 61mâ¦
ID (FET equivalent) = 50A
E
C
G
TO-247AC
Absolute Maximum Ratings
Parameter
VCES
Collector-to-Emitter Voltage
IC @ TC = 25°C
Continuous Collector Current
IC @ TC = 100°C
Continuous Collector Current
ICM
ILM
Pulse Collector Current (Ref. Fig. C.T.4)
d Clamped Inductive Load Current
IF @ TC = 25°C
Diode Continous Forward Current
IF @ TC = 100°C
IFRM
Diode Continous Forward Current
e Maximum Repetitive Forward Current
VGE
Gate-to-Emitter Voltage
PD @ TC = 25°C
Maximum Power Dissipation
PD @ TC = 100°C Maximum Power Dissipation
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Thermal Resistance
Parameter
RθJC (IGBT)
RθJC (Diode)
RθCS
RθJA
Thermal Resistance Junction-to-Case-(each IGBT)
Thermal Resistance Junction-to-Case-(each Diode)
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
Weight
1
Max.
600
75
45
150
150
40
15
60
±20
390
156
-55 to +150
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
Units
V
A
V
W
°C
Min.
âââ
âââ
âââ
âââ
âââ
Typ.
âââ
âââ
0.24
âââ
6.0 (0.21)
Max.
0.32
1.7
âââ
40
âââ
Units
°C/W
g (oz)
www.irf.com
1/25/06
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